5G Ready

AAEON is recognized as an Intel Premium Partner for its help in accelerating the adoption of advanced IoT and edge networks by leveraging technologies including edge computing and 5G communication.

Get the latest 5G platforms updates

Overview　|　5G in Industrial 4.0　|　5G Ready Platforms

5G is the next big step in wireless communication. 5G networks will provide 50x more speed, 10x less latency, and 1,000x more capacity than 4G/LTE. It promises to bring faster internet service to consumers, with larger data transfer capabilities for industries to roll out the next generation of IoT devices and expand the capabilities of cloud and edge computing. It promises to bring a new age of connectivity and communication, further driving Industry 4.0.

Making compute available where data is created.

5G is going to power the future of IoT and Edge devices and bring the level of performance needed for a massive IoT ecosystem.

20x DATA RATES

4G: 1 Gb/s

5G: 20 Gb/s

10x CONNECTED DEVICES

4G: 100K

5G: 1M

10x LOWER LATENCY

4G: 10ms

5G: 1ms

7x DATA TRAFFIC

4G: 7.2EB

5G: 50EB

9x ENERGY EFFICIENCY

4G: 90% more energy used / bit

5G: 10%

IoT DEVICE PERFORMANCE

5G: up to 10-year battery life

The transformative power of 5G will change interconnection at the edge. In the era of 5G, technologies will converge to enable the intelligent edge, IoT, and AI, working together to streamline business operations and effectively use data at scale.

Developers who face both time sync (coordinated events) and timeliness (timely events) challenges with industrial applications such as robotic arms and motion controllers, can use TSN together with real-time features on Intel® architecture to synchronize networks of devices for improving the timely behavior of industrial systems. As compared with existing real-time Ethernet protocols, combining TSN with real-time features on Intel® architecture can enable customers to precisely control time-sensitive cycles.

With new IoT innovations and expanded AI capabilities, the world will be smarter and more connected than ever.

AAEON + Intel are enabling “edge to cloud seamless connectivity” and meeting multiple vertical use cases to rapid deploy and scale AI-based solutions.

AAEON Unveiled Their Entire Lineup Of 5G-Ready Platforms.

AAEON has unveiled their entire lineup of innovative 5G-ready platforms for 2021, consisting of embedded single-board computers, industrial motherboards, fanless embedded box PCs, network video recorders, and desktop network appliances.

How does Ericsson accelerate Industrial 4.0 with 5G?

Join AAEON and Ericsson as we share how smart manufacturing with 5G can optimize processes for efficiency, flexibility, and sustainability as well as increase production and profitability through automation.

Smart sensors, connected devices, and IoT tools, 5G can support up to a million devices.

BOXER-6643-TGU

Fanless Embedded Box PC 11th Gen Intel® Core™ SoC Processor
(formerly Tiger Lake)

UP Squared 6000

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GENE-EHL5

Latest Intel® Atom™ x6000E processor
(formerly Elkhart Lake)

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PRELIMINARY

3.5" SubCompact Board with latest Intel® Atom™ x6000E processor
(formerly Elkhart Lake)

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PRELIMINARY

FWS-2365

Desktop Network Appliance with Intel® Atom® Processor C3000 series
(formerly Denverton)

UP Xtreme i11

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MAX-Q470A

Latest 11th Gen Intel® Core™ processor with Intel Iris X^e graphic
(formerly Tiger Lake)

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Micro-ATX Industrial Motherboard with 10th Gen Intel® Core™ Processor
(for formerly Comet Lake)

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PRELIMINARY

VPC-3350S-VS

PRELIMINARY

Multi-PoE & Fanless Appliance with Intel® Pentium®/ Celeron®/ Atom™
(formerly Apollo Lake)

VPC-5620S-VS

Learn More

UP Xtreme Lite

Multi-PoE & Fanless Appliance with 8th Gen Intel® Processor
(for formerly Whiskey Lake)

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High performing edge computing board with 8th Gen Intel® Core™ Processor
(formerly Whiskey Lake)

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UP Connect Plus

Carrier board for UP Core Plus and UP Xtreme platforms designed to support 5G module and 3x GbLAN ports.

UP Squared Pro

Industrial 5G with Intel Celeron® N3350 / Pentium® N4200 / Atom® x7-E3950
(formerly Apollo Lake)

Learn More Learn More

Wide range from Intel Atom® processors to the latest 11th Gen Intel® Core™ processors platforms

Atom® x6000E Series　(formerly Elkhart Lake)

UP Squared 6000

UP Squared 6000	PRELIMINARY
Processor	Intel® Celeron® N6210 (up to 2.6 Ghz) Intel® Pentium® J6426 (up to 2.7 Ghz) Intel Atom® x6413E (up to 3.0 Ghz) Intel Atom® x6425RE (No Turbo by default)
Memory	2 Channel x LPDDR4 (3200MT/s) up to 16GB Intel® Celeron® N6210 – 2GB Intel® Pentium® J6426 – 4GB Intel Atom® x6413E – 4GB Intel Atom® x6425RE – 8GB/16GB
Storage	1x eMMC – 　[Intel® Celeron® N6210 – 32GB 　Intel® Pentium® J6426 – 32GB 　Intel Atom® x6413E – 32GB 　Intel Atom® x6425RE – 64GB] via 1x SATA with power connection, 1x SATA on Carrier Board 1x M.2 2280 [NVMe]
VPU	optional (via M.2 2280)
FPGA	N/A
TPM	TPM 2.0 onboard
Connectivity
5G	optional (via M.2 3042/3052)
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	2x GbE via (1 x Intel.WGI210IT ,1 x Intel.I225-LM), 2x GbE via Marvell Alaska on Carrier Board
I/O
Display I/O	1x HDMI 2.0b, 1x DP 1.2, 1x eDP
Audio I/O	Audio jack line-in/out 1x HDMI Audio, 1x DP Audio
USB	2x USB 3.1 Type-A (STACK connector), 1x USB 3.1 Type-C (OTG support) 1x Micro USB (debug port PSE) on Carrier Board
Serial Port	1x RS232/422/485 1x RS232/422/485 on Carrier Board
HDD interface	1x SATA with power connector 1x SATA with power connector on Carrier Board
SIM slot	Yes
Expansion Slot	1x M.2 2230 E Key, 1x M.2 2242/2280 M Key (supports NMVe SSD), 1x M.2 3042/3052 B Key, 1x Mini PCIe slot on Carrier Board
CAN Bus	Yes, CAN bus via 100-pin carrier board
Physical & Environmental Spec
Power Requirement	12V
PoE	N/A
Dimension	TBD
Gross weight	TBD

GENE-EHL5

GENE-EHL5	PRELIMINARY
Processor	Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series Processors
Memory	1x DDR4 SO-DIMM Slot, up to 32GB (Support inband ECC)
Storage	1x SATA III, 1x eMMC, up to 32GB, 1x M.2 2242 B key
VPU	TBD
FPGA	TBD
TPM	TPM 1.2 onboard
Connectivity
5G	Optional (via M.2 3052, with Nano-SIM)
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	2x Intel GbE
I/O
Display I/O	1x LVDS x 1 (Option: 1x eDP) 1x HDMI 1.4 1x DP 1.4 (Option: 1x VGA)
Audio I/O	Line In / Line Out / MIC
USB	2x USB 3.2 Gen 2 Type A, 4x USB 2.0 (pin header)
Serial Port	4x RS232/422/485 (internal header)
HDD interface	1x SATA III
SIM slot	TBD
Expansion Slot	1x M.2 2230 E Key, 1x M.2 2242 B Key, 1x M.2 3052 B Key (With Nano-SIM)
CAN Bus	TBD
Physical & Environmental Spec
Power Requirement	Wide DC Input 9-36V (Optional: 12V Only)
PoE	N/A
Dimension	146mm x 101.7mm (5.75″ x 4″)
Gross weight	TBD

PICO-EHL4

PICO-EHL4	PRELIMINARY
Processor	Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series Processors
Memory	LPDDR4x 4267 MHz on board memory, In-Band ECC (select SKUs)
Storage	1x eMMC 1x SATA 1x SATA Power (5V)
VPU	TBD
FPGA	TBD
TPM	N/A
Connectivity
5G	N/A
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	2x Gigabit Ethernet LAN ports RTL8111G, 10/100/1000Base, (Compatible with RJ45 x 1)
I/O
Display I/O	2x HDMI2.0b, 4K, 60Hz; Single channel 12V/3.3V, 18-24 bit LVDS/ eDP 1.3 (Default: LVDS)
Audio I/O	N/A
USB	2x USB 3.2 Gen 2 /rear IO 2x USB 2.0 /header
Serial Port	2x RS232/422/485
HDD interface	1x SATA
SIM slot	N/A
Expansion Slot	1x M.2 2230 E key (For WIFI/BT, PCIe/USB signal only), 1x mini-PCIe(Full) (Default mSATA or USB 2.0, PCIe[x1]x1 by BIOS) 1x SMBUS/I2C + eSPI 1x CAN BUS x 1
CAN Bus	Yes
Physical & Environmental Spec
Power Requirement	+12V AT/ATX (default)
PoE	N/A
Dimension	100mm x 72mm (3.94″ x 2.84″)
Gross weight	TBD

MIX-EHLD1

MIX-EHLD1	PRELIMINARY
Processor	Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series Processors
Memory	2x SO-DIMM, up to 32GB , DDR4 3200MTS
Storage	1x SATA 6Gb/s 1x SATA power connector (5V / 12V @1A) 1x M.2 2280 M key (PCIe[x2])
VPU	TBD
FPGA	TBD
TPM	Nuvoton NPCT750 TPM2.0 onboard
Connectivity
5G	Optional (via M.2 3042/3052)
WiFi	TBD
Bluetooth	TBD
Ethernet	2x RTL8111H
I/O
Display I/O	1x VGA Up to 1920 x 1200 @60 Hz, 1x HDMI Up to 4096 x 2160 @ 60Hz, 1x LVDS/eDP Up to 1920 x 1080 @60Hz, Daul Channel 18/24 bit (via CH7513) co-layout eDP (default LVDS)/ Up to 3840 x 2160 @ 30Hz
Audio I/O	Realtek® ALC897 Line In / Line Out 1x AAFP follow ASUS pin out
USB	2x USB 3.2 Gen 1 Type A, 4x USB 2.0 (upper 2 ports by BOM Optional)
Serial Port	RS232 by BOM Optional
HDD interface	1x SATA
SIM slot	Yes (default for B-key)
Expansion Slot	1x M.2 3042/3052 B Key 1x mini-PCIe(Full/Half)
CAN Bus	TBD
Physical & Environmental Spec
Power Requirement	12(+/-5%) DC
PoE	N/A
Dimension	170mm x 170mm (6.7″ x 6.7″)
Gross weight	1.1 lb (0.5 Kg)

NITX-EHL1

NITX-EHL1	PRELIMINARY
Processor	Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series Processor
Memory	2x SO-DIMM, up to 32GB, DDR4 3200 MHz
Storage	1x M.2 2280 M-Key slot (PCIex2/SATA)
VPU	TBD
FPGA	N/A
TPM	TPM 2.0 onboard
Connectivity
5G	optional (via M.2 3052)
WiFi	optional (via M.2 2242)
Bluetooth	optional (via M.2 2242)
Ethernet	1x 1GbE LAN (Realtek 8111H), 1x 2.5GbE LAN (Intel i225LM) *vPRO is only available in i7/i5 CPU
I/O
Display I/O	1x HDMI 2.0, 1x LVDS
Audio I/O	2x Audio Jack: 1x Line-out(green) + 1x MIC (pink)
USB	Front: 2x USB 3.2 Type A Rear: 2x USB 3.2 Type A Internal: 1x USB 2.0 header
Serial Port	4x RS232 pin-header
HDD interface	N/A
SIM slot	TBD
Expansion Slot	1x M.2 2230 E Key, 1x M.2 2280 B Key, 1x M.2 3052 B Key
CAN Bus	TBD
Physical & Environmental Spec
Power Requirement	12-24V
PoE	N/A
Dimension	120 mm x 120 mm (4.8″ x 4.8″)
Gross weight	TBD

Celeron® / 11th Gen Intel® Core™ i3/i5/i7 based　(formerly Tiger Lake)

UP Xtreme i11

UP Xtreme i11	PRELIMINARY
Processor	Intel® Core™ i7-1185G7E ( up to 4.4 GHz) Intel® Core™ i5-1145G7E ( up to 4.1 GHz) Intel® Core™ i3-1115G4E ( up to 3.9 GHz) Intel® Celeron 6305E ( up to 2.0 Ghz)
Memory	2x DDR4 2 channel SO-DIMM VERTICAL MAX 64GB @ 3200MT/s
Storage	via 1x SATA 3.0 connector with power connector / 1x M.2 2280 M key (combo 2x PCIE[x1]) NVME
VPU	optional (via M.2 2280)
FPGA	Intel® FPGA Altera Max V for 40-pin GP-bus
TPM	TPM 2.0 onboard
Connectivity
5G	optional (via M.2 3052)
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	1x 1GbLAN (i219), 1x 2.5Gb LAN (i225), *vPRO is only available in i7/i5 CPU
I/O
Display I/O	1x HDMI 2.0b, 1x DP + 1x USB Type-C (1x DP 1.4/ USB 4.0), 1x eDP
Audio I/O	1x HDMI Audio, 1x DP Audio Soundwire Codec for Audio Out/Mic In, I2S
USB	4x USB 3.2 Gen 2 Type A 1x USB 4.0 Type C
Serial Port	1x RS232/422/485
HDD interface	1x SATA 3.0
SIM slot	Yes
Expansion Slot	1x M.2 2230 E key, 1x M.2 2280 M key (support NVME SSD), 1x M.2 3052 B key, 1x PCI-E[x4] (adapter board accessory required)
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	12V DC-IN ( lockable connector)
PoE	N/A
Dimension	120 mm x 122 mm (4.8″ x 4.8″)
Gross weight	524.1g

BOXER-6643-TGU

BOXER-6643-TGU	PRELIMINARY
Processor	Intel® Core™ i7-1185G7E ( up to 4.40 GHz) Intel® Core™ i5-1145G7E ( up to 4.10 GHz) Intel® Core™ i3-1115G4E ( up to 3.90 GHz)
Memory	2x DDR4 SO-DIMM, up to 64GB
Storage	Support High-Speed NVMe storage (M.2 2280) 1x 2.5” SATA SSD/HDD bay
VPU	optional (via M.2 2280)
FPGA	N/A
TPM	N/A
Connectivity
5G	optional (via M.2 3052)
WiFi	optional (via Mini-Card)
Bluetooth	optional (via Mini-Card), combo with WiFi Module
Ethernet	1x 1Gb LAN (i219), 1x 2.5Gb LAN (i225), *vPRO is only available in i7/i5 CPU
I/O
Display I/O	2x HDMI 1.4
Audio I/O	Line Out
USB	4x USB 3.2 Gen 2 Type A
Serial Port	2x DB-9 for RS-232/422/485
HDD interface	1x 2.5” SATA SSD/HDD bay
SIM slot	Yes
Expansion Slot	1x M.2 2280 M Key, 1x M.2 3052 B Key (for 5G module), 1x Full-Size Mini Card (mSATA/PCIe Auto Switch)
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	Wide Range 9-36V DC input
PoE	N/A
Dimension	280 mm x 152mm x 44 mm (11.02″ x 5.98″ x 1.73″)
Gross weight	TBD

GENE-TGU6

GENE-TGU6	PRELIMINARY
Processor	Intel® Core™ i7-1185G7E (4C, 1.7GHz, up to 4.4 GHz) Intel® Core™ i5-1145G7E (4C, 1.5GHz, up to 4.1 GHz) Intel® Core™ i3-1115G4E (2C, 2.2GHz, up to 3.9 GHz) Intel® Celeron® 6305E (2C, 1.80GHz,TDP 15W)
Memory	2x DDR4 2 channel 3200MHz SO-DIMM (Dual Channel ,Non-ECC)
SSD	SATA 3.0 x 1 SATA power connector x 1(+5V)
VPU	optional (via M.2 2280)
FPGA	TBD
TPM	TPM 2.0 onboard
Connectivity
5G	N/A
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	1x Intel ®i219-LM,10/100/1000Base,RJ45 (Support vPRO), 1x Intel ®i225-LM, 10/100/1000/2500Base,RJ45 (Support vPRO) *vPRO is only available in i7/i5 CPU
I/O
Display I/O	1x HDMI 2.0b x 1, 2x DP 1.4a x 2, 1x Dual Channel 18/24bit LVDS/eDP (Default: LVDS)
Audio I/O	High Definition Audio Interface,Line-in/Line-out/MIC (Without Amplifier)
USB	4x USB 3.2 Gen 2 Type A (Rear I/O) 1x USB 3.2 Gen 2 Type C (Rear I/O) 2x USB 2.0 (Pin header)
Serial Port	4x RS-232/422/485(COM2 support 5V/12V/RI)
HDD interface	N/A
SIM slot	Yes (NANO-SMI)
Expansion Slot	1x Full size mSATA/mPCIe With Nano-SIM (mSATA as default, select by BIOS ) 1x M.2 2230 E key (For WIFI/BT, PCIe/USB signal only) 4x M.2 2280 M key PCIe
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	+9 ~ 36V (Optional: +12V)
PoE	N/A
Dimension	146mm x 101.7mm (5.75″ x 4″)
Gross weight	TBD

PICO-TGU4

PICO-TGU4	PRELIMINARY
Processor	Intel® Core™i7-1185G7E (4C, 1.8GHz, up to 4.4GHz) Intel® Core™i5-1145G7E (4C, 1.5GHz, up to 4.1GHz) Intel® Core™i3-1115G4E (2C, 2.2GHz, up to 3.9GHz) Intel® Celeron® 6305E (2C, 1.8GHz) (i7-1185GRE/i5-1145GRE/i3-1115GRE by customer’s request)
Memory	LPDDR4x 3200 MHz on board memory, In-Band ECC (select SKUs), up to 32GB
Storage/SSD	1x SATA 1x SATA Power (5V)
VPU	optional (via M.2 2280)
FPGA	N/A
TPM	TPM 2.0 onboard
Connectivity
5G	N/A
WiFi	optional (via Mini-Card)
Bluetooth	optional (via Mini-Card), combo with WiFi Module
Ethernet	1x Intel® i225, 10/100/1000/2500Base, RJ45 x1 1x Intel® i219, 10/100/1000Base, RJ45 x1 *vPRO is only available in i7/i5 CPU
I/O
Display I/O	1x HDMI 2.0b, 4Kx2K 60Hz 1x eDP, up to HBR3, 8Kx4K 30Hz
Audio I/O	High Definition Audio Interface, Line-in/Line-out/MIC (optional)
USB	2x USB 3.2 Gen 2/rear IO 2x USB 3.2 Gen 1/header 4x USB 2.0/header
Serial Port	2x RS-232/422/485
HDD interface	—
SIM slot	N/A
Expansion Slot	1x M.2 2280 M key (PCIE GEN4 as default, SATA select by HW BOM) 1x Full size mPCIe/mSATA or USB2.0 (PCIe as default, SATA select by BIOS) 1x SMBUS/I2C and eSPI (SMBUS as default, I2C select by HW BOM)
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	+12V AT/ATX (default)
PoE	N/A
Dimension	100mm x 72mm (3.94″ x 2.84″)
Gross weight	0.55 lb (0.25 Kg)

COM-TGUC6

COM-TGUC6	PRELIMINARY
Processor	11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3)
Memory	2x DDR4 3200 MHz SO-DIMM (Dual Channel) in-band ECC supported by SoC
Storage	—
VPU	N/A
FPGA	N/A
TPM	TPM 2.0 Optional
Connectivity
5G	N/A
WiFi	N/A
Bluetooth	N/A
Ethernet	1x Intel® I225LM Gigabit Ethernet
I/O
Display I/O	1x LVDS/eDP (Default : LVDS), 3x DDI, 1x VGA
Audio I/O	High Definition Audio Interface
USB	4x USB 3.2 Gen 2, 8x USB 2.0
Serial Port	2x 2-wire UART ( TX/RX)
HDD interface	2x SATA 3.0
SIM slot	N/A
Expansion Slot	5x PCIe 5 lanes [x1] PEG[x4], I2C, LPC, SMBus
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	Standard: +12V
PoE	N/A
Dimension	95mm x 95mm (3.75″ x 3.75″)
Gross weight	TBD

MIX-TLUD1

MIX-TLUD1	PRELIMINARY
Processor	Intel® Core™ i7-1185G7E, QC, Max Speed up to 4.4GHz Intel® Core™ i5-1145G7E, QC, Max Speed up to 4.1GHz Intel® Core™ i3-1115G4E, DC, Max Speed up to 3.9GHz Intel® Celeron® 6305E, DC, 1.8GHz
Memory	2x DDR4 2666/3200 MHz SODIMM, Up to 64GB
Storage	1x M.2 2280 M key for (NVMe;PCIex4) storage 1x SATA 6.0Gb/s
VPU	optional (via M.2 2280)
FPGA	N/A
TPM	Nuvoton NPCT750 TPM2.0 onboard
Connectivity
5G	N/A
WiFi	N/A
Bluetooth	N/A
Ethernet	1x Intel® PCIe Gb LAN 219LM 1x Intel® PCIe Gb LAN 225LM *vPRO is only available in i7/i5 CPU
I/O
Display I/O	1x HDMI 2.0, 1x DP 1.4, 1x LVDS, Up to 1920 x 1200 @60Hz, Dual Channel 18/24 bit (via CH7511B) 1x eDP1.4b
Audio I/O	Realtek® ALC887 Mic-in x 1, Line out x 1
USB	1x USB 3.0 Box header (support additional USB3.2 Gen1 x 2ports)
Serial Port	2x Box header for COM (COM1/2: RS-232)
HDD interface	—
SIM slot	Yes
Expansion Slot	1x PCIe 3.0 [x4], 1x mini-card (PCIe/SATA; BOM Optional)
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	12(+/-5%) DC
PoE	N/A
Dimension	170mm x 170mm (6.7” x 6.7”)
Gross weight	1.1 lb (0.5 Kg)

Pentium®/ 10th Gen Intel® Core™ i3/i5/i7/i9 based　(formerly Comet Lake)

MAX-Q470A

MAX-Q470A	PRELIMINARY
Processor	Intel® 10th Generation (Comet Lake-S) Core™ i9 /i7/ i5 /i3, Pentium® 14nm LGA 1200 socket Processor
Memory	4x DIMM, DDR4 (2933/2666/2400 MHz, max. 128GB) non-ECC, un-buffered memory Dual-channel memory architecture
Storage	4x SATA III (6.0Gb/s) ports, support RAID 0/1/5/10 1x M.2 2280/2242 M key (PCIex4)
VPU	optional (via M.2 2280/2242)
FPGA	N/A
TPM	TPM 2.0 onboard
Connectivity
5G	optional (via M.2 3042/3052)
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	1x Intel® PHY i219LM (supports Intel® AMT 12.0), 1x Intel® i211AT, 2x RJ45
I/O
Display I/O	3x HDMI (1x HDMI 2.0 & 2x HDMI 1.4) 1x VGA 1x 40-pin LVDS connector (internal)
Audio I/O	3x Audio Jack: Line-in, Mic-in, Line-out 1x Speaker header Line-out (internal) 1x AAFP (internal)
USB	2x USB 3.2 Gen 2 Type A, 4x USB 3.2 Gen 1 Type A Internal connectors: 1x USB 3.2 Gen1 box header support additional 2 USB ports (2x5PIN, p=2.54mm) 1x USB 3.2 Gen1 Type A (vertical) connector, 1x USB 2.0 header support additional 2 USB ports (2x5PIN, p=2.54mm)
Serial Port	1x DB-9 COM (supports RS-232/422/485, 5V/12V/RI), 3x RS-232 headers (internal)
HDD interface	4x SATA 3.0 support RAID 0/1/5/10
SIM slot	Yes
Expansion Slot	1x M.2 2230 E key (PCIe/CNVI), 1x M.2 2280/2242 M key (PCIex4), 1x M.2 3042/3052/2242 B-key (PCIe/USB/SATA), 1x PCIe 3.0[x16] Slot (16 lanes) (8 lanes when dual use PCIe[x16]), 1x PCIe 3.0[x16] (8 lanes), 1x PCIe 3.0[x4] Slot x 1, 1x PCIe 3.0[x4] Slot (2 lanes), 1x Micro SIM card Slot
CAN Bus	TBD
Physical & Environmental Spec
Power Requirement	1x 24-pin ATX connector 1x 8-pin (2×4) ATX 12V Power connector
PoE	N/A
Dimension	Micro-ATX Form Factor 244 mm x 244 mm (9.6″ x 9.6″)
Gross weight	800g

Atom® C3000 based　(formerly Denverton)

FWS-2365

FWS-2365
Processor	Intel® Atom® Processor C3000 series (4~16 cores)
Memory	2x DDR4 SO-DIMM socket
Storage	Onboard 16GB eMMC, 2x SATA III Port, 1x 2.5” HDD Bay
VPU	N/A
FPGA	N/A
TPM	TPM v2.0 9665 onboard
Connectivity
5G	optional (via M.2 3042/3052)
WiFi	optional (via Mini-Card)
Bluetooth	optional (via Mini-Card), combo with WiFi Module
Ethernet	6x 1 GbE RJ-45 (2 ports co-lay SFP) 4x 10G SFP+ (4 cores only support 2 ports)
I/O
Display I/O	Console Port
Audio I/O	N/A
USB	2x USB 3.0 Type A (1 Port only support USB 2.0 signal)
Serial Port	N/A
HDD interface	2x SATA III port, 2.5” HDD/SSD up to 2
SIM slot	Yes
Expansion Slot	1x Mini-card slot (Half-size, PCIe), 1x Mini-card slot (Full-size, PCIe + USB2.0) with SIM slot, 1x M.2 3052 B key (USB3.0) with SIM slot
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	12V DC-in connector 4 Cores: 40W Power Adapter 8 Cores and above: 60W Power Adapter
PoE	N/A
Dimension	260 mm x 178 mm x 44 mm (10.23″ x 7.00″ x 1.73″)
Gross weight	TBD

Celeron® / 8th Gen Intel® Core™ i3/i5/i7 based　(formerly Whiskey Lake)

VPC-5620S-VS

UP Xtreme Lite

VPC-5620S-VS

VPC-5620S-VS	PRELIMINARY
Processor	Intel® 8th Generation (Whisky Lake) Core™ i7/ i5 /i3 (Default: i7-8665UE; Project base: i5-8365UE, i3-8145UE or 4305UE)
Memory	DDR4 260-pin SO-DIMM, up to 64GB
Storage	Supporting 2.5″ SSD x 2 (Supporting 2.5″ SSD x 1, mSATA x 1, by project base)
VPU	optional (via M.2 2280 of PER-T623)
FPGA	N/A
TPM	N/A
Connectivity
5G	optional (via M.2 3052 of PER-T623 SKU3)
WiFi	optional (via Mini-Card)
Bluetooth	optional (via Mini-Card), combo with WiFi Module.
Ethernet	1x Intel® i211, support Wake on LAN and PXE supported
I/O
Display I/O	1x HDMI 1.4 1x DP 1.2
Audio I/O	1x jack for Line out & Mic-in
USB	4x USB 3.2 Gen 1 Type A
Serial Port	2x RS-232/422/485 (Isolated by BOM option)
HDD interface	2x 2.5″ HDD/SSD Bay
SIM slot	Yes
Expansion Slot	1x M.2 2280 M key (USB+PCIe), support NVME PCIe [x4] SSD 1x mPCIe Full-Size (USB+PCIe) 1x mPCIe Full-Size (USB+SATA) colay SATA
CAN Bus	Yes, it’s supported in In-Vehicle SKU. (It can also be supported using a 3rd Part CANBus Module in any SKUs.)
Physical & Environmental Spec
Power Requirement	DC 12-24V; DC 9-36V with power ignition (In-vehicle config. by project base)
PoE	4 ports (Max. 8 ports by project base), IEEE 802.3 AT/AF, sharing 60W of power budget for every four PoE ports. Able to power management in each independent PoE port (SDK available)
Dimension	180 mm x 149 mm x 55 mm (6.3″ x 5.87″ x 2.16″)
Gross weight	TBD

UP Xtreme Lite

UP Xtreme Lite
Processor	Intel® Core™ i7-8565U ( up to 4.60 GHz) Intel® Core™ i5-8265U ( up to 3.90 GHz) Intel® Core™ i3-8145U ( up to 3.90 GHz)
Memory	1x DDR4 SO-DIMM Slot (up to 16GB)
Storage	1x SATA3 (6Gb/s): 　a. 1x SATA Connector 　b. 1x M.2 2280 M Key NVMe(PCIe [x2])/SATA (auto-detect)
VPU	optional (via M.2 2280)
FPGA	N/A
TPM	N/A
Connectivity
5G	optional (via. M.2 3042/3052)
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	2x Intel® i211
I/O
Display I/O	1x HDMI 1.4 1x DP 1.2
Audio I/O	Audio Jack Lin Out/Mic In
USB	2x USB 3.2 Gen 2 Type-A (Front) 2x USB 3.2 Gen 2 Type-A (Rear) 2x 10-pin USB 2.0
Serial Port	2x internal 10-pin RS232/422/485 Pin Header
HDD interface	1x SATA 3.0
SIM slot	Yes
Expansion Slot	1x M.2 2230 E Key 1x M.2 2280 M Key (PCIe [x2]) 1x M.2 3042/3052 B Key 1x 40-pin HAT Connector
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	12V~24V DC-in (lockable connector)
PoE	N/A
Dimension	122 mm x 120 mm (4.80″ x 4.72″)
Gross weight	526.6g

Celeron® / Pentium®/ Atom® based　(formerly Apollo Lake)

VPC-3350S-VS

UP Squared Pro

VPC-3350S-VS

VPC-3350S-VS	PRELIMINARY
Processor	Intel® Pentium®/ Celeron®/ Atom™ Processor (Default: E3940; Project base: N4200/N3350, or E3950 with customized chassis)
Memory	DDR3L 204-pin SO-DIMM, up to 8GB
Storage	Supporting 2.5” SSD x 1 (Optional SKU: Supporting additional mSATA x1 & eMMC)
VPU	optional (via Mini-PCIe Slot)
FPGA	N/A
TPM	N/A
Connectivity
5G	optional (via M.2 3052 of PER-T623 SKU3)
WiFi	optional (via Mini-Card)
Bluetooth	optional (via Mini-Card), combo with WiFi Module.
Ethernet	Intel® i211 (colay i210)
I/O
Display I/O	1x HDMI 1.4 1x DP 1.2
Audio I/O	1x Audio Line-out 1x Mic-In
USB	2x USB 3.2 Gen 1 Type A
Serial Port	2x RS-232/422/485
HDD interface	1x 2.5” HDD/SSD Bay
SIM slot	Yes
Expansion Slot	2x Mini-Card slot (USB 2.0 + PCIe, full size), up to 4 slots (In-vehicle platform), Built-in CANBus (In-vehicle platform)
CAN Bus	Yes, built-in CANBus (In-vehicle platform)
Physical & Environmental Spec
Power Requirement	DC 12-24V; DC 9-36V with power ignition (In-vehicle platform)
PoE	4 ports, sharing 60W of power budget for every four PoE ports
Dimension	160mm x 134mm x 75mm (6.3” x 5.28” x 2.44”)
Gross weight	TBD

UP Squared Pro

UP Squared Pro
Processor	Intel® Celeron® Duo Core N3350 (up to 2.4 GHz) Intel® Pentium® Quad Core N4200 (up to 2.5 GHz) Intel Atom® Quad Core x7-E3950 Processor (up to 2.0 GHz)
Memory	2GB 4GB 8GB
Storage	32GB 64GB
VPU	optional (via M.2 2280)
FPGA	Intel® FPGA Altera MAX 10
TPM	TPM 2.0 onboard
Connectivity
5G	optional (via M.2 3042/3052 B co-lay)
WiFi	optional (via M.2 2230)
Bluetooth	optional (via M.2 2230)
Ethernet	2x Intel® i210 AT (support TSN) TSN enabled for Industrial SKU PN only – UPN-APLX7F-A10-0464
I/O
Display I/O	1x HDMI 1.4b 1x DP 1.2
Audio I/O	Audio jack line-in/out
USB	3x USB 3.0 Type A 1x USB 3.0 OTG
Serial Port	2x RS232/422/485
HDD interface	1x SATA 3.0
SIM slot	Yes
Expansion Slot	1x M.2 E key 2230 1x M.2 M key 2280 1x M.2 B key co-lay 3042/3052
CAN Bus	N/A
Physical & Environmental Spec
Power Requirement	12V~24V DC-in (lockable connector)
PoE	N/A
Dimension	101.6 mm x 101.6mm (4″ x 4″)
Gross weight	TBD

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