FWS-8600, a 2U rackmount network appliance powered by dual 2nd Generation Intel® Xeon® Scalable Processors, was awarded Gold Partner in Intel® Network Builders Winners’ Circle Program 2021 for being successfully deployed as a MEC (multi-access edge computing) gateway in smart manufacturing applications. By adopting dual 2nd Generation Intel® Xeon® Scalable Processors, FWS-8600 accelerates the compute processing performance and reduces the latency when deployed as an edge computing gateway. With built-in Intel® Deep Learning Boost engine, FWS-8600 accelerates the AI deployments, such as robotic arms and self-driving transport vehicles. To meet the required memory bandwidth for 5G smart manufacturing, FWS-8600 supports up to 512GB DDR4 RDIMM ECC RAM. For enhanced networking bandwidth, FWS-8600 can support a maximum LAN throughput of 300 – 400 Gbps.
FWS-8600 is powered by dual 2nd Generation Intel® Xeon® Scalable Processors to offer workload-optimized and AI-acceleration performance for data-intensive, multitasking workloads in smart manufacturing environments. The 2nd Generation Intel® Xeon® Scalable Processors support up to 56 cores and 112 threads to realize high-performance compute for 5G MEC applications. With improved interconnect technology, huge volume of traffic generated by AI projects can be intelligently managed between the computing cores to reduce the latency while optimizing performances.
Scalable by Design
FWS-8600 is designed with four NIM (network interface module) slots (can be scalable up to 8 slots by projects) to maximize network throughput and bandwidth for AIoT edge computing. Based on benchmark testing, FWS-8600 can support up to 300 – 400 Gbps for networking throughputs.
Optimized for AIoT
With the built-in Intel® Deep Learning Boost engine enabled by the 2nd Generation Intel® Xeon® Scalable Processors, FWS-8600 can accelerate deployments and reduce training cost and time for AI and machine-learning projects such as robots and autonomous transport vehicles.
Expanded Memory Bandwidth
FWS-8600 supports up 512GB DDR4 RDIMM ECC RAM to meet the demands for 5G MEC applications like smart manufacturing where huge volume of data is generated by AI-enabled devices. With such memory capacity, latency can be further reduced to improve efficiency on the manufacturing floors.