Expanding Vertical Markets with High-Performance Computing Maker Board | UP Squared 6000

With Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC, UP Squared 6000 Redefines Edge Computing and Expands Your Vertical Markets
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UP Squared 6000 by AAEON is a high-performance industrial computing maker board at small form factor (101.6mm x 101.6mm) powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake). With the next-generation IoT-enhanced processors, UP Squared 6000 delivers up to 1.7x single-thread performance, 1.5x multi-thread performance, and 2x graphical processing performance enabled by Intel® UHD Graphics (11th Generation GPU) to help customers optimize their vertical markets. Aside from significant performance upgrades, UP Squared 6000 supports Intel® Programmable Service Engine (PSE) that enables remote management even when the system is powered off. The onboard TPM (Trusted Platform Module) 2.0 ensures system security from tampering. For further expandability and scalability in edge AIoT verticals markets, UP Squared 6000 comes with multiple M.2 sockets for Intel® Myriad X module, NVMe storage, 5G connectivity and Wi-Fi5/6 modules. In addition, UP Squared 6000 features 40-pin GPIO (HAT-compatible) and 100-pin board-to-board connector (available in Intel® Atom® x6000E/RE SKUs only) for I/O expansions through a carrier board.

For further expandability and scalability in edge AIoT verticals markets, UP Squared 6000 comes with multiple M.2 sockets for Intel® Myriad X module, NVMe storage, 5G connectivity and Wi-Fi5/6 modules. In addition, UP Squared 6000 features 40-pin GPIO (HAT-compatible) and 100-pin board-to-board connector (available in Intel® Atom® x6000E/RE SKUs only) for I/O expansions through a carrier board.

 
Optimal Performance for Vertical Markets

Powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake), UP Squared 6000 delivers up to 1.7x single-thread performance, 1.5x multi-thread performance, and 2x graphical processing performance enabled by Intel® UHD Graphics (11th Generation GPU) to drive optimal performances required for today’s vertical markets, such as robotics, smart agriculture, retail, and vision-intensive applications.

High-Density Expansion

UP Squared 6000 comes with multiple M.2 sockets for Intel® Myriad X module, NVMe storage, 5G connectivity and Wi-Fi/BT modules. In addition, it also features 40-pin HAT-compatible GPIO and 100-pin board-to-board connector (available in in Intel® Atom® x6000E/RE SKUs only) for further I/O expansion through a carrier board. With the carrier board, UP Squared 6000 will drive full potential of Intel® Programmable Service Engine by offering CAN Bus, QEP, additional dual GbE Ethernet ports, and RS-232 for industrial applications (the carrier board is supported in SKUs with Intel Atom® x6425RE and Intel Atom® x6413E processors and is scheduled for official launch in Q2, 2022).

Made for Smart Remote Management

Smart Remote Management is a critical feature in Smart Factory, allowing asset managers to remotely monitor valuable assets. Powered by the next-generation IoT-enhanced processor and through the connections with the carrier board, UP Squared 6000 can take advantage of Intel® Programmable Service Engine (PSE) offering Out-of-Band (OOB) Management, which lets IT personnel to remotely manage manufacturing assets even when the operating system is unresponsive or the device is powered off.

UP Squared 6000 Edge and Edge Computing Kit

UP Squared 6000 Edge is a derived series of UP Squared 6000, based on the same mainboard. With purpose-built housing, UP Squared 6000 Edge features all I/O connectivity of the mainboard and is capable of executing IoT enhancements including Time-Sensitive Networking (TSN), Time-Coordinated Computing (TCC), in-band ECC, and onboard TPM 2.0. On the other hand, by integrating UP Squared 6000 mainboard and the additional carrier board to unlock Intel® Programmable Service Engine (PSE), the UP Squared 6000 Edge Computing Kit further accelerates computer vision and deep learning applications with its preloaded Intel® Distribution of OpenVINO™ toolkit.

For those interested in the trial version of the carrier board and Intel® Programmable Service Engine (PSE), the UP Squared 6000 Edge Computing Kit is scheduled to be launched in Q1, 2022 to meet the demands while the carrier board will be officially in the market by Q2.

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