Providing High-Performance Computing in a Globally Connected World
- AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard
- Extensive lineup of COM Express modules from AAEON includes the Intel® Xeon® D series processor (formerly Ice Lake D) based COM Express Type 7 and the 11th Generation Intel® Core™ processor (formerly Tiger Lake UP3) based COM Express Type 10
- Dedicated engineer team support for COM projects helps to shorten the time to market
(Eindhoven, The Netherlands) – In today’s globally connected world, data is shared more frequently and in greater volumes than ever before. Consequently, this requires more powerful information processing technology, yet there remains a demand across all computing mediums for the hardware processing this information to be smaller, faster, and more sophisticated.
For this reason, AAEON, a leading manufacturer of industrial IoT and AI Edge solutions, has introduced its latest Computer-on-Module (COM) innovations, including the 12th Generation Intel® Core™ processor-based COM-HPC standard client module, the Intel® Xeon® D series processor-based COM Express Type 7, and the 11th Generation Intel® Core™ processor-based COM Express Type 10.
The AAEON COM-HPC module, HPC-ADSC, features the 12th Generation Intel® Core™ processor (formerly Alder Lake S) for high-speed processing, widespread connectivity, and environmental resilience for flexible deployment in IoT industrial contexts. It supports PCIe x16 Generation 5 interface and two DDR5 SODIMM memory sockets with in-band ECC support for up to 128 GB capacity. It is integrated with 25 GbE and 2.5 GbE interfaces for huge data transmission.
The AAEON COM Express Type 7, COM-ICDB7, is powered by the latest Intel® Xeon® D series (formerly Ice Lake D). It’s a high-performance computing unit for enhancing connectivity, streamlining communication, and building the infrastructure of the future. It supports PCIe x16 Generation 4 and four DDR4 SODIMM sockets with in-band ECC support for up to 128 GB. It is integrated with four 10 GbE and one 1 GbE interfaces.
The AAEON COM Express Type 10, NanoCOM-TGU, features the 11th Generation Intel® Core™ series (formerly Tiger Lake UP3) for high-speed processing on the smallest form factor. It supports PCIe x4 Generation 4 interface, LPDDR4x for up to 16GB, and onboard NVMe for up to 512 GB. It is integrated with a 2.5 GbE interface, a DDI interface, and eDP interface. It supports a wide temperature range between -40~ +85C for harsh environment applications.
Additions, customizations, and project-specific features can be accommodated on AAEON COM Express modules thanks to AAEON’s expertise in OEM and ODM. For quick and high-quality technical service support on Computer-on-Module projects, AAEON offers the “Q Service.”
The AAEON Q Service is a dedicated engineering support team that will co-design and co-debug alongside customers during the development of their COM Express projects. With experienced design and field application engineers, AAEON’s Q Service is committed to helping customers reduce the time spent on troubleshooting and expediting the development process.
AAEON will showcase the new COM-HPC standard and COM Express product line at their booth in Embedded World on June 21 – 23, 2022. Visit Booth #306 in Hall 1 at Nuremberg Messe, Germany to learn more.
Established in 1992, AAEON is one of the leading designers and manufacturers of industrial IoT and AI Edge solutions. With continual innovation as a core value, AAEON provides reliable, high-quality computing platforms including industrial motherboards and systems, rugged tablets, embedded AI Edge systems, uCPE network appliances, and LoRaWAN/WWAN solutions.