5G Ready for AI & IoT

AAEON is recognized as an Intel Premium Partner for its help in accelerating the adoption of advanced IoT and edge networks by leveraging technologies including edge computing and 5G communication.

Get the latest 5G platforms updates

What is 5G

5G is the next big step in wireless communication. 5G networks will provide 50x more speed, 10x less latency, and 1,000x more capacity than 4G/LTE. It promises to bring faster internet service to consumers, with larger data transfer capabilities for industries to roll out the next generation of IoT devices and expand the capabilities of cloud and edge computing. It promises to bring a new age of connectivity and communication, further driving Industry 4.0.

Moving beyond faster

Making compute available where data is created.

5G is going to power the future of IoT and Edge devices and bring the level of performance needed for a massive IoT ecosystem.

20x DATA RATES
4G: 1 Gb/s
5G: 20 Gb/s
10x CONNECTED DEVICES
4G: 100K
5G: 1M
10x LOWER LATENCY
4G: 10ms
5G: 1ms
7x DATA TRAFFIC
4G: 7.2EB
5G: 50EB
9x ENERGY EFFICIENCY
4G: 90% more energy used / bit
5G: 10%
IoT DEVICE PERFORMANCE
4G
5G: up to 10-year battery life

How does 5G benefit Edge system

The transformative power of 5G will change interconnection at the edge. In the era of 5G, technologies will converge to enable the intelligent edge, IoT, and AI, working together to streamline business operations and effectively use data at scale.

5G in Industrial 4.0

Developers who face both time sync (coordinated events) and timeliness (timely events) challenges with industrial applications such as robotic arms and motion controllers, can use TSN together with real-time features on Intel® architecture to synchronize networks of devices for improving the timely behavior of industrial systems. As compared with existing real-time Ethernet protocols, combining TSN with real-time features on Intel® architecture can enable customers to precisely control time-sensitive cycles.

Connecting the dots: 5G Ready for AI & IoT

With new IoT innovations and expanded AI capabilities, the world will be smarter and more connected than ever.

AAEON + Intel are enabling “edge to cloud seamless connectivity” and meeting multiple vertical use cases to rapid deploy and scale AI-based solutions.

Specifications of AAEON 5G Ready Platforms

Press Release

AAEON Unveiled Their Entire Lineup Of 5G-Ready Platforms.

AAEON has unveiled their entire lineup of innovative 5G-ready platforms for 2021, consisting of embedded single-board computers, industrial motherboards, fanless embedded box PCs, network video recorders, and desktop network appliances.

Smart Factory Solutions Webinar

How does Ericsson accelerate Industrial 4.0 with 5G?

Join AAEON and Ericsson as we share how smart manufacturing with 5G can optimize processes for efficiency, flexibility, and sustainability as well as increase production and profitability through automation.

Connecting Data at the Edge

Smart sensors, connected devices, and IoT tools, 5G can support up to a million devices.

Industrial automation

Video Surveillance

Retail

Smart City

Robotics

Smart Agriculture

5G ready platforms

Slide BOXER-6643-TGU Fanless Embedded Box PC 11th Gen Intel® Core™ SoC Processor
(formerly Tiger Lake)
UP Squared 6000 Learn More GENE-EHL5 Latest Intel® Atom™ x6000E processor
(formerly Elkhart Lake)
Learn More PRELIMINARY 3.5" SubCompact Board with latest Intel® Atom™ x6000E processor
(formerly Elkhart Lake)
Learn More PRELIMINARY PRELIMINARY
Slide FWS-2365 Desktop Network Appliance with Intel® Atom® Processor C3000 series
(formerly Denverton)
UP Xtreme i11 Learn More MAX-Q470A Latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic
(formerly Tiger Lake)
Learn More Micro-ATX Industrial Motherboard with 10th Gen Intel® Core™ Processor
(for formerly Comet Lake)
Learn More PRELIMINARY
Slide PRELIMINARY VPC-3350S-VS PRELIMINARY Multi-PoE & Fanless Appliance with Intel® Pentium®/ Celeron®/ Atom™
(formerly Apollo Lake)
VPC-5620S-VS Learn More UP Xtreme Lite Multi-PoE & Fanless Appliance with 8th Gen Intel® Processor
(for formerly Whiskey Lake)
Learn More High performing edge computing board with 8th Gen Intel® Core™ Processor
(formerly Whiskey Lake)
Learn More
Slide UP Connect Plus Carrier board for UP Core Plus and UP Xtreme platforms designed to support 5G module and 3x GbLAN ports. UP Squared Pro Industrial 5G with Intel Celeron® N3350 / Pentium® N4200 / Atom® x7-E3950
(formerly Apollo Lake)
Learn More Learn More

Supported Platforms

Wide range from Intel Atom® processors to the latest 11th Gen Intel® Core™ processors platforms

UP Squared 6000PRELIMINARY
ProcessorIntel® Celeron® N6210 (up to 2.6 Ghz)
Intel® Pentium® J6426 (up to 2.7 Ghz)
Intel Atom® x6413E (up to 3.0 Ghz)
Intel Atom® x6425RE (No Turbo by default)
Memory2 Channel x LPDDR4 (3200MT/s) up to 16GB
Intel® Celeron® N6210 – 2GB
Intel® Pentium® J6426 – 4GB
Intel Atom® x6413E – 4GB
Intel Atom® x6425RE – 8GB/16GB
Storage1x eMMC –
 [Intel® Celeron® N6210 – 32GB
 Intel® Pentium® J6426 – 32GB
 Intel Atom® x6413E – 32GB
 Intel Atom® x6425RE – 64GB]
via 1x SATA with power connection,
1x SATA on Carrier Board
1x M.2 2280 [NVMe]
VPUoptional (via M.2 2280)
FPGAN/A
TPMTPM 2.0 onboard
Connectivity
5Goptional (via M.2 3042/3052)
WiFioptional (via M.2 2230)
Bluetoothoptional (via M.2 2230)
Ethernet2x GbE via (1 x Intel.WGI210IT ,1 x Intel.I225-LM),
2x GbE via Marvell Alaska on Carrier Board
I/O
Display I/O1x HDMI 2.0b,
1x DP 1.2,
1x eDP
Audio I/OAudio jack line-in/out
1x HDMI Audio,
1x DP Audio
USB2x USB 3.1 Type-A (STACK connector),
1x USB 3.1 Type-C (OTG support)
1x Micro USB (debug port PSE) on Carrier Board
Serial Port1x RS232/422/485
1x RS232/422/485 on Carrier Board
HDD interface1x SATA with power connector
1x SATA with power connector on Carrier Board
SIM slotYes
Expansion Slot1x M.2 2230 E Key,
1x M.2 2242/2280 M Key (supports NMVe SSD),
1x M.2 3042/3052 B Key,
1x Mini PCIe slot on Carrier Board
CAN BusYes, CAN bus via 100-pin carrier board
Physical & Environmental Spec
Power Requirement12V
PoEN/A
DimensionTBD
Gross weightTBD

GENE-EHL5PRELIMINARY
ProcessorIntel Atom® x6000E Series and
Intel® Pentium® and Celeron® N and J Series Processors
Memory1x DDR4 SO-DIMM Slot, up to 32GB (Support inband ECC)
Storage1x SATA III,
1x eMMC, up to 32GB,
1x M.2 2242 B key
VPUTBD
FPGATBD
TPMTPM 1.2 onboard
Connectivity
5GOptional (via M.2 3052, with Nano-SIM)
WiFioptional (via M.2 2230)
Bluetoothoptional (via M.2 2230)
Ethernet2x Intel GbE
I/O
Display I/O1x LVDS x 1 (Option: 1x eDP)
1x HDMI 1.4
1x DP 1.4 (Option: 1x VGA)
Audio I/OLine In / Line Out / MIC
USB2x USB 3.2 Gen 2 Type A,
4x USB 2.0 (pin header)
Serial Port4x RS232/422/485 (internal header)
HDD interface1x SATA III
SIM slotTBD
Expansion Slot1x M.2 2230 E Key,
1x M.2 2242 B Key,
1x M.2 3052 B Key (With Nano-SIM)
CAN BusTBD
Physical & Environmental Spec
Power RequirementWide DC Input 9-36V (Optional: 12V Only)
PoEN/A
Dimension146mm x 101.7mm (5.75″ x 4″)
Gross weightTBD

NITX-EHL1 PRELIMINARY
ProcessorIntel Atom® x6000E Series and
Intel® Pentium® and Celeron® N and J Series Processor
Memory2x SO-DIMM, up to 32GB, DDR4 3200 MHz
Storage1x M.2 2280 M-Key slot (PCIex2/SATA)
VPUTBD
FPGAN/A
TPMTPM 2.0 onboard
Connectivity
5Goptional (via M.2 3052)
WiFioptional (via M.2 2242)
Bluetoothoptional (via M.2 2242)
Ethernet1x 1GbE LAN (Realtek 8111H),
1x 2.5GbE LAN (Intel i225LM)
*vPRO is only available in i7/i5 CPU
I/O
Display I/O1x HDMI 2.0,
1x LVDS
Audio I/O2x Audio Jack: 1x Line-out(green) + 1x MIC (pink)
USBFront: 2x USB 3.2 Type A
Rear: 2x USB 3.2 Type A
Internal: 1x USB 2.0 header
Serial Port4x RS232 pin-header
HDD interfaceN/A
SIM slotTBD
Expansion Slot1x M.2 2230 E Key,
1x M.2 2280 B Key,
1x M.2 3052 B Key
CAN BusTBD
Physical & Environmental Spec
Power Requirement12-24V
PoEN/A
Dimension120 mm x 120 mm (4.8″ x 4.8″)
Gross weightTBD

UP Xtreme i11PRELIMINARY
ProcessorIntel® Core™ i7-1185G7E ( up to 4.4 GHz)
Intel® Core™ i5-1145G7E ( up to 4.1 GHz)
Intel® Core™ i3-1115G4E ( up to 3.9 GHz)
Intel® Celeron 6305E ( up to 2.0 Ghz)
Memory2x DDR4 2 channel SO-DIMM VERTICAL MAX 64GB @ 3200MT/s
Storagevia 1x SATA 3.0 connector with power connector / 1x M.2 2280 M key (combo 2x PCIE[x1]) NVME
VPUoptional (via M.2 2280)
FPGAIntel® FPGA Altera Max V for 40-pin GP-bus
TPMTPM 2.0 onboard
Connectivity
5Goptional (via M.2 3052)
WiFioptional (via M.2 2230)
Bluetoothoptional (via M.2 2230)
Ethernet1x 1GbLAN (i219),
1x 2.5Gb LAN (i225),
*vPRO is only available in i7/i5 CPU
I/O
Display I/O1x HDMI 2.0b,
1x DP + 1x USB Type-C (1x DP 1.4/ USB 4.0),
1x eDP
Audio I/O1x HDMI Audio,
1x DP Audio
Soundwire Codec for Audio Out/Mic In,
I2S
USB4x USB 3.2 Gen 2 Type A
1x USB 4.0 Type C
Serial Port1x RS232/422/485
HDD interface1x SATA 3.0
SIM slotYes
Expansion Slot1x M.2 2230 E key,
1x M.2 2280 M key (support NVME SSD),
1x M.2 3052 B key,
1x PCI-E[x4] (adapter board accessory required)
CAN BusN/A
Physical & Environmental Spec
Power Requirement12V DC-IN ( lockable connector)
PoEN/A
Dimension120 mm x 122 mm (4.8″ x 4.8″)
Gross weight524.1g

BOXER-6643-TGUPRELIMINARY
ProcessorIntel® Core™ i7-1185G7E ( up to 4.40 GHz)
Intel® Core™ i5-1145G7E ( up to 4.10 GHz)
Intel® Core™ i3-1115G4E ( up to 3.90 GHz)
Memory2x DDR4 SO-DIMM, up to 64GB
StorageSupport High-Speed NVMe storage (M.2 2280)
1x 2.5” SATA SSD/HDD bay
VPUoptional (via M.2 2280)
FPGAN/A
TPMN/A
Connectivity
5Goptional (via M.2 3052)
WiFioptional (via Mini-Card)
Bluetoothoptional (via Mini-Card), combo with WiFi Module
Ethernet1x 1Gb LAN (i219),
1x 2.5Gb LAN (i225),
*vPRO is only available in i7/i5 CPU
I/O
Display I/O2x HDMI 1.4
Audio I/OLine Out
USB4x USB 3.2 Gen 2 Type A
Serial Port2x DB-9 for RS-232/422/485
HDD interface1x 2.5” SATA SSD/HDD bay
SIM slotYes
Expansion Slot1x M.2 2280 M Key,
1x M.2 3052 B Key (for 5G module),
1x Full-Size Mini Card (mSATA/PCIe Auto Switch)
CAN BusN/A
Physical & Environmental Spec
Power RequirementWide Range 9-36V DC input
PoEN/A
Dimension280 mm x 152mm x 44 mm (11.02″ x 5.98″ x 1.73″)
Gross weightTBD

MAX-Q470APRELIMINARY
ProcessorIntel® 10th Generation (Comet Lake-S) Core™ i9 /i7/ i5 /i3,
Pentium® 14nm LGA 1200 socket Processor
Memory4x DIMM, DDR4 (2933/2666/2400 MHz, max. 128GB)
non-ECC, un-buffered memory
Dual-channel memory architecture
Storage4x SATA III (6.0Gb/s) ports, support RAID 0/1/5/10
1x M.2 2280/2242 M key (PCIex4)
VPUoptional (via M.2 2280/2242)
FPGAN/A
TPMTPM 2.0 onboard
Connectivity
5Goptional (via M.2 3042/3052)
WiFioptional (via M.2 2230)
Bluetoothoptional (via M.2 2230)
Ethernet1x Intel® PHY i219LM (supports Intel® AMT 12.0),
1x Intel® i211AT,
2x RJ45
I/O
Display I/O3x HDMI (1x HDMI 2.0 & 2x HDMI 1.4)
1x VGA
1x 40-pin LVDS connector (internal)
Audio I/O3x Audio Jack: Line-in, Mic-in, Line-out
1x Speaker header Line-out (internal)
1x AAFP (internal)
USB2x USB 3.2 Gen 2 Type A,
4x USB 3.2 Gen 1 Type A

Internal connectors:
1x USB 3.2 Gen1 box header support additional 2 USB ports (2x5PIN, p=2.54mm)
1x USB 3.2 Gen1 Type A (vertical) connector,
1x USB 2.0 header support additional 2 USB ports (2x5PIN, p=2.54mm)
Serial Port1x DB-9 COM (supports RS-232/422/485, 5V/12V/RI),
3x RS-232 headers (internal)
HDD interface4x SATA 3.0 support RAID 0/1/5/10
SIM slotYes
Expansion Slot1x M.2 2230 E key (PCIe/CNVI),
1x M.2 2280/2242 M key (PCIex4),
1x M.2 3042/3052/2242 B-key (PCIe/USB/SATA),
1x PCIe 3.0[x16] Slot (16 lanes) (8 lanes when dual use PCIe[x16]), 1x PCIe 3.0[x16] (8 lanes),
1x PCIe 3.0[x4] Slot x 1, 1x PCIe 3.0[x4] Slot (2 lanes),
1x Micro SIM card Slot
CAN BusTBD
Physical & Environmental Spec
Power Requirement1x 24-pin ATX connector
1x 8-pin (2×4) ATX 12V Power connector
PoEN/A
DimensionMicro-ATX Form Factor
244 mm x 244 mm (9.6″ x 9.6″)
Gross weight800g

FWS-2365
ProcessorIntel® Atom® Processor C3000 series (4~16 cores)
Memory2x DDR4 SO-DIMM socket
StorageOnboard 16GB eMMC,
2x SATA III Port,
1x 2.5” HDD Bay
VPUN/A
FPGAN/A
TPMTPM v2.0 9665 onboard
Connectivity
5Goptional (via M.2 3042/3052)
WiFioptional (via Mini-Card)
Bluetoothoptional (via Mini-Card), combo with WiFi Module
Ethernet6x 1 GbE RJ-45 (2 ports co-lay SFP)
4x 10G SFP+ (4 cores only support 2 ports)
I/O
Display I/OConsole Port
Audio I/ON/A
USB2x USB 3.0 Type A (1 Port only support USB 2.0 signal)
Serial PortN/A
HDD interface2x SATA III port,
2.5” HDD/SSD up to 2
SIM slotYes
Expansion Slot1x Mini-card slot (Half-size, PCIe),
1x Mini-card slot (Full-size, PCIe + USB2.0) with SIM slot,
1x M.2 3052 B key (USB3.0) with SIM slot
CAN BusN/A
Physical & Environmental Spec
Power Requirement12V DC-in connector
4 Cores: 40W Power Adapter
8 Cores and above: 60W Power Adapter
PoEN/A
Dimension260 mm x 178 mm x 44 mm (10.23″ x 7.00″ x 1.73″)
Gross weightTBD

VPC-5620S-VSPRELIMINARY
ProcessorIntel® 8th Generation (Whisky Lake) Core™ i7/ i5 /i3
(Default: i7-8665UE; Project base: i5-8365UE, i3-8145UE or 4305UE)
MemoryDDR4 260-pin SO-DIMM, up to 64GB
StorageSupporting 2.5″ SSD x 2 (Supporting 2.5″ SSD x 1, mSATA x 1, by project base)
VPUoptional (via M.2 2280 of PER-T623)
FPGAN/A
TPMN/A
Connectivity
5Goptional (via M.2 3052 of PER-T623 SKU3)
WiFioptional (via Mini-Card)
Bluetoothoptional (via Mini-Card), combo with WiFi Module.
Ethernet1x Intel® i211, support Wake on LAN and PXE supported
I/O
Display I/O1x HDMI 1.4
1x DP 1.2
Audio I/O1x jack for Line out & Mic-in
USB4x USB 3.2 Gen 1 Type A
Serial Port2x RS-232/422/485 (Isolated by BOM option)
HDD interface2x 2.5″ HDD/SSD Bay
SIM slotYes
Expansion Slot1x M.2 2280 M key (USB+PCIe), support NVME PCIe [x4] SSD
1x mPCIe Full-Size (USB+PCIe)
1x mPCIe Full-Size (USB+SATA) colay SATA
CAN BusYes, it’s supported in In-Vehicle SKU.
(It can also be supported using a 3rd Part CANBus Module in any SKUs.)
Physical & Environmental Spec
Power RequirementDC 12-24V; DC 9-36V with power ignition (In-vehicle config. by project base)
PoE4 ports (Max. 8 ports by project base), IEEE 802.3 AT/AF, sharing 60W of power budget for every four PoE ports.
Able to power management in each independent PoE port (SDK available)
Dimension180 mm x 149 mm x 55 mm (6.3″ x 5.87″ x 2.16″)
Gross weightTBD

UP Xtreme Lite
ProcessorIntel® Core™ i7-8565U ( up to 4.60 GHz)
Intel® Core™ i5-8265U ( up to 3.90 GHz)
Intel® Core™ i3-8145U ( up to 3.90 GHz)
Memory1x DDR4 SO-DIMM Slot (up to 16GB)
Storage1x SATA3 (6Gb/s):
 a. 1x SATA Connector
 b. 1x M.2 2280 M Key NVMe(PCIe [x2])/SATA (auto-detect)
VPUoptional (via M.2 2280)
FPGAN/A
TPMN/A
Connectivity
5Goptional (via. M.2 3042/3052)
WiFioptional (via M.2 2230)
Bluetoothoptional (via M.2 2230)
Ethernet2x Intel® i211
I/O
Display I/O1x HDMI 1.4
1x DP 1.2
Audio I/OAudio Jack Lin Out/Mic In
USB2x USB 3.2 Gen 2 Type-A (Front)
2x USB 3.2 Gen 2 Type-A (Rear)
2x 10-pin USB 2.0
Serial Port2x internal 10-pin RS232/422/485 Pin Header
HDD interface1x SATA 3.0
SIM slotYes
Expansion Slot1x M.2 2230 E Key
1x M.2 2280 M Key (PCIe [x2])
1x M.2 3042/3052 B Key
1x 40-pin HAT Connector
CAN BusN/A
Physical & Environmental Spec
Power Requirement12V~24V DC-in (lockable connector)
PoEN/A
Dimension122 mm x 120 mm (4.80″ x 4.72″)
Gross weight526.6g

VPC-3350S-VSPRELIMINARY
ProcessorIntel® Pentium®/ Celeron®/ Atom™ Processor
(Default: E3940; Project base: N4200/N3350, or E3950 with customized chassis)
MemoryDDR3L 204-pin SO-DIMM, up to 8GB
StorageSupporting 2.5” SSD x 1 (Optional SKU: Supporting additional mSATA x1 & eMMC)
VPUoptional (via Mini-PCIe Slot)
FPGAN/A
TPMN/A
Connectivity
5Goptional (via M.2 3052 of PER-T623 SKU3)
WiFioptional (via Mini-Card)
Bluetoothoptional (via Mini-Card), combo with WiFi Module.
EthernetIntel® i211 (colay i210)
I/O
Display I/O1x HDMI 1.4
1x DP 1.2
Audio I/O1x Audio Line-out
1x Mic-In
USB2x USB 3.2 Gen 1 Type A
Serial Port2x RS-232/422/485
HDD interface1x 2.5” HDD/SSD Bay
SIM slotYes
Expansion Slot2x Mini-Card slot (USB 2.0 + PCIe, full size), up to 4 slots (In-vehicle platform),
Built-in CANBus (In-vehicle platform)
CAN BusYes, built-in CANBus (In-vehicle platform)
Physical & Environmental Spec
Power RequirementDC 12-24V; DC 9-36V with power ignition (In-vehicle platform)
PoE4 ports, sharing 60W of power budget for every four PoE ports
Dimension160mm x 134mm x 75mm (6.3” x 5.28” x 2.44”)
Gross weightTBD

UP Squared Pro
ProcessorIntel® Celeron® Duo Core N3350 (up to 2.4 GHz)
Intel® Pentium® Quad Core N4200 (up to 2.5 GHz)
Intel Atom® Quad Core x7-E3950 Processor (up to 2.0 GHz)
Memory2GB
4GB
8GB
Storage32GB
64GB
VPUoptional (via M.2 2280)
FPGAIntel® FPGA Altera MAX 10
TPMTPM 2.0 onboard
Connectivity
5Goptional (via M.2 3042/3052 B co-lay)
WiFioptional (via M.2 2230)
Bluetoothoptional (via M.2 2230)
Ethernet2x Intel® i210 AT (support TSN)
*TSN enabled for Industrial SKU PN only – UPN-APLX7F-A10-0464*
I/O
Display I/O1x HDMI 1.4b
1x DP 1.2
Audio I/OAudio jack line-in/out
USB3x USB 3.0 Type A
1x USB 3.0 OTG
Serial Port2x RS232/422/485
HDD interface1x SATA 3.0
SIM slotYes
Expansion Slot1x M.2 E key 2230
1x M.2 M key 2280
1x M.2 B key co-lay 3042/3052
CAN BusN/A
Physical & Environmental Spec
Power Requirement12V~24V DC-in (lockable connector)
PoEN/A
Dimension101.6 mm x 101.6mm (4″ x 4″)
Gross weightTBD

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