The new UP 4000 maker board combines the ethos of the first-generation UP Board with innovative new features for modern industrial computing solutions. With upgrades in processing power, I/O density, and expansion options, the UP 4000 retains its predecessor’s form factor while providing a high-quality, low-cost board for the next generation. The UP 4000 also remains compatible with existing UP Board applications, enabling upgrades to existing UP Board-powered systems.
Powered by the Intel® Apollo Lake platform, the UP 4000 boasts a substantial improvement in CPU performance, with a 30% increase in CPU speeds and twice the 3D graphics performance. This provides the increased processing power required for more industrial and comprehensive computing on the edge.
The UP 4000 offers a number of new features to facilitate application development. The first is a 6-pin wafer to support audio function, making it easier for customers to get mic-in and line-out utility through cable connection. The addition of a HDMI 1.4 port, along with a DP1.2-supporting USB Type-C connector also enables dual visual displays up to 4K at 60Hz.
With three USB 3.2 Gen 1 ports, two USB 2.0 pin headers, and a USB Type-C slot supporting USB 3.0 OTG on a compact board, the UP 4000 offers a dense and versatile I/O. However, this is compounded by the expandability provided by the UP 4000’s optional carrier board, which hosts two M.2 Key ports capable of supporting Wi-Fi, 5G, or AI modules.