Helping our customers embrace the newest Intel® technologies, AAEON presents its trifecta of fanless embedded Box PCs featuring the 12th Generation Intel® Core™/Celeron® Processor platform. With a lineup serving needs as diverse as compact, efficient computing solutions to those requiring server-grade performance in a tough, ruggedized chassis for harsh environments, AAEON’s fanless embedded Box PC family is truly comprehensive.
AAEON’s fanless embedded Box PCs incorporate the full spectrum of 12th Generation Intel® Core™/Celeron® Processor models, for everything from heavy workloads to energy-efficiency.
Complete Power Protection
Wide range DC input with circuit protection features mean AAEON’s fanless embedded Box PCs offer unprecedented stability for applications with unstable power sources.
Innovative Thermal Solutions
Innovative thermal solutions expand the product line’s capacity to power solutions from 15W mobile CPUs all the way to 65W socket type processors, with rugged and fanless chassis for harsh environments.
Solutions from the fanless embedded Box PC range are equipped with multiple interface configurations designed to synergize the functions needed for applications across any vertical market.
Resilient, Rugged Hardware
Contingent features such as wide operating temperatures, variable power input ranges, and anti-vibration and shock features bring you hardware that is durable, resilient, and reliable.
AAEON’s Fanless Embedded Box PC Family
Made for applications that demand high-performance computing, the BOXER-6645-ADS represents what happens when every aspect of a PC is augmented to channel the 12th Gen platform for extreme performance.
Where efficiency meets power, the BOXER-6646-ADP offers unique deployment potential with its compact form factor, low energy consumption, and sophisticated expansion options to help customers build without limits.
Designed for high-level operation in smaller spaces, the BOXER-6451-ADP marries precision with functionality. Innovative cooling technology protects against overheating, enabling deployment in smaller spaces.