Dear customers,
As the market situation is changing quickly, we want to continually update you on the current key components outlook from AAEON. We have provided details below on Memory, Storage, Intel CPUs, GPU, and OS to give you a better understanding of this year’s situation, so we can plan together for success.
AAEON New Products
| Product |  |
|
|
|---|---|---|---|
| CPU | Intel Atom® x7000E Series and N-series Processors | Intel® Xeon® | DDR4l Atom® x7000E Series, N Series, i3-N305 |
| Memory | DDR5 SODIMM x 1 | DDR4 RDIMM x 6 | DDR5 SODIMM x 1 |
| Storage | SATA III x 1 with SATA Power Connector (1A) M.2 2280 M-Key x 1 (PCIe [x1] / NVMe / SATA) | M.2 2280 M key PCIe x 1 SATA III ports x 8 | SATA 6.0Gbps x 1 |
| Others & Expansions | M.2 3042/3052 B-Key x 1 (PCIe [x1], SATA, USB 3.2 Gen 1/USB 2.0) with SIM socket M.2 2230 E-Key x 1 (PCIe [x1], USB 2.0) | PCIE 1: PCIe x16 (Gen4) slot PCIE 2: PCIe x8 (Gen3) slot PCIE 3: PCIe x16 (Gen4) slot PCIE 4: PCIe x8 (Gen4) slot PCIE 5: PCIe x16 (Gen4) slot PCIE 6: PCIe x8 (Gen3) slot PCIE 7: PCIe x8 (Gen4) slot | Full Sized mPCIe x 1 Full Sized mSATA x 1 M.2 2242 B-key x 1 |
CPUs
Intel Planning Price Hike Across All “Core” CPUs As a Part of Restructuring Policy
- Intel will reportedly increase the pricing of its current CPU lineup to squeeze out revenue for fab development and restructure the company as a whole.
- Intel’s Price Bump Could Have Regional Limits, All “Core” CPUs Will Have an Effect
- Microsoft has updated its official list of supported processors for Windows 11, which saw several Intel Xeon CPUs removed. And add new AMD Ryzen to supported list.
New CPUs Target the Needs of AI, Cloud, and Data Center Customers
- Intel is touting the upcoming 14th Gen Meteor Lake as a significant technological enhancement over the 13th Gen Raptor Lake. The 14th Gen Meteor Lake’s processor will feature a built-in Vision Processing Unit to perform AI tasks more efficiently.
- If Intel gradually reduces support for the older generation series to focus on the latest addition, there may price up for the old series. It will be a good timing to store the old gen now.
Sources: WCCFTECH, Neowin, Anandtech,
Storage/Memory
Continuing reducing NAND Flash Production to Balance Supply and Demand and Counteract SSD Price Decline
- Samsung will implement a large-scale production cut to reduce NAND inventory, with an aim to reduce stocks to a normal level by the end of the year.
- Samsung has elected to pause certain operations within its P1 NAND flash manufacturing line.
- SK hynix bets on memory chip recovery through further cut in NAND production.
- NAND flash memory suppliers appear determined to raise prices, resulting in a modest increase in spot market prices for August, according to industry sources.
Memory/Storage Price will Hike Up in the Second Half Year
- Chinese memory module makers have stopped offering product quotes or accepting orders as they expect memory chip suppliers to soon hike their prices.
- There are rumors that some manufacturers have already stockpiled goods and waited for the price increase.
- There are expectations that the AI demand boom will continue and drive an increase in DRAM demand, as experts expect that the market has bottomed out. Estimations indicate that AI could drive demand for both DRAM and NAND, with DRAM seeing the largest uptick.
Sources: Digitimes, Guru3D, koreatimes, DIGITIMES, Digitimes,
Connectivity Modules
Fibocom Unveils Non-Terrestrial Networks Module MA510-GL (NTN)
- During MWC Shanghai 2023, Fibocom announces the global launch of the Non-Terrestrial Networks (NTN) module MA510-GL (NTN) and showcases the live NTN demonstration based on Qualcomm’s NB-IoT over NTN technology. The module focuses on enabling satellite and cellular communication for IoT devices at global reach, making it possible to connect reliably and seamlessly anywhere, anytime.
Fibocom 5G R16-compliant Module FM160-EAU Achieved Telstra Certification
- The 3GPP Release 16 compliant module FM160-EAU has achieved the Telstra certification. The module has been tested and verified on Telstra’s network to provide ahigh-performance 5G broadband service, driving the 5G adoption across industries such as FWA, security monitoring, and Industrial IoT in the regional market.
GPUs
NVIDIA announced NVIDIA OVX™ servers featuring the new NVIDIA® L40S GPU
- A powerful, universal data center processor designed to accelerate the most compute-intensive, complex applications, including AI training and inference, 3D design and visualization, video processing and industrial digitalization with the NVIDIA Omniverse™ platform.
- To power high-fidelity professional visualization workflows like real-time rendering, product design and 3D content creation, the NVIDIA L40S GPU includes 142 third-generation RT Cores that deliver 212 teraflops of ray-tracing performance.
- For computationally demanding workflows, such as engineering and scientific simulations, the NVIDIA L40S includes 18,176 CUDA® cores, delivering nearly 5x the single-precision floating-point (FP32) performance of the NVIDIA A100 GPU to accelerate complex calculations and data-intensive analyses.
- The NVIDIA L40S will be available starting this fall. Global system builders, including ASUS, Dell Technologies, GIGABYTE, HPE, Lenovo, QCT and Supermicro, will soon offer OVX systems that include the NVIDIA L40S GPUs. These servers will help professionals worldwide advance AI and bring generative AI applications like intelligent chatbots, search and summarization tools to users across industries.
Sources: NVIDIA
| CPU | EP-CPI5105SRH6C | Intel® Core™ i5 10500E Processor | |
| EP-CPI5125SRL6V | Intel® Core ™i5 12500TE Processor | ||
| EP-CPI5125SRL6W | Intel® Core ™I5 12500E Processor | ||
| EP-CPI3121SRL6T | Intel® Core ™I3 12100TE Processor | ||
| Memory | EP-DR05S008AD01 | SO-DIMM DDR5 4800 1.1V 8GB 1024X16 AD5S48008G4-BSSB 0ºC to 85ºC | |
| EP-DR05U016BW01 | DDR5, 4800 MHz, UDIMM, 16GB, 0-85c. B45DUAG74840B-T021 | ||
| EP-DR04U08GRAA6 | DDR4 2666Mhz U DIMM 288Pin 8GB 1024×8 0-85c, Samsung IC, with 3-year warranty, with AAEON Branding | ||
| Storage | EP-SSM242256AA1 | M.2 2242 256G, SATAIII 3D TLC, S11 controller + Toshiba BiCs4, 0~70 | |
| EP-SS25-064AACS | 2.5” 7mm SSD 64G 3D TLC, S11 controller + Toshiba BiCs4, 0~70°C | ||
| GPU/MXM | EP-GPMXMT1000PN | MXM-T1000-PN (with heatsink&FANsuit MMT1000-4GA/F19-Vxx) Frequency 1395-1455MHz Memory 4096MB GDDR6 PCI-e 3.0 DirectX 12 API MAX 4 display support Up to 4 DP 0-50℃50W (92-3T1000-100X-Y) | |
| EP-GPTCSA30M-PB | TCSA30M-PB (A30) | ||
| TBD | NVIDIA H100 PCIE | ||
| Connectivity | EP-WFJWW6051V01 | M.2 2230 E key Dual band 802.11ac/a/b/g/n Wi-Fi+Bluetooth4.2, Qualcomm QCA6174A Windows & Linux (Ath10k) 2T2R 0-70C | |
| EP-FMEC25EMPCIe | Quectel LTE CAT4 Multi-Mode solution, 2G, 3G, 4G band connectivity, Provides LTE Cat4 150MB DL / 50MB UL and HSPA+ 42MB DL / 5,75MB UL and GPRS Include synchronous GNSS receiver, for EMEA, Korea, Thailand, India | ||
P Trade Team
If you have any further questions, please feel free to our P Trade Team for more details.
Jeff Lee, Product Sales Manager
JeffLee@aaeon.eu
In charge of GPU, M2M, PSU, Chassis, etc.
Yang Li, Buyer
YangLi@aaeon.eu
In charge of SSD, DRAM, CPU
Best Regards,
The AAEON Team