Press Releases

Providing High-Performance Computing in a Globally Connected World AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard Extensive lineup of COM Express modules from AAEON includes the Intel® Xeon® D series processor (formerly Ice Lake D) based COM Express Type 7 and …

Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules Read More »

Easy access to deep learning technologies for machine vision applications The bundle is ready for immediate use and enables a wide range of applications thanks to its easy-to-use approach Eindhoven, March 23, 2022 – UP Bridge the Gap, a brand belonging to AAEON, a leading manufacturer of AI Edge hardware solutions, is partnering with MVTec Software …

Machine vision: AAEON, MVTec, and Basler offer joint deep learning bundle Read More »

AAEON’s latest UP Bridge the Gap platforms are now compatible with the Hailo-8 AI module, offering unprecedented AI performance for edge devices across industries. Tel Aviv, Israel, & Eindhoven, The Netherlands,  February 16, 2022 – UP Bridge the Gap, a brand of AAEON – a leading manufacturer of AI Edge hardware solutions – is pleased …

AAEON Partners with AI Chipmaker Hailo to Enable Next-Gen AI Applications at the Edge Read More »

(Eindhoven, The Netherlands – December 7, 2021) AAEON, a leading designer and manufacturer of industrial IoT and AI Edge solutions, has partnered with Fibocom to introduce high-speed 5G capability to their new edge computing platforms. AAEON’s latest innovations, UP Xtreme i11 and UP Squared Pro, are compatible with the Fibocom FM150 5G module via the …

AAEON is Bringing High-Speed 5G Capability to Edge Computing Platforms Read More »